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» Nickel-palladium bond pads for copper wire bonding
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MR
2011
351views Robotics» more  MR 2011»
11 years 6 months ago
Nickel-palladium bond pads for copper wire bonding
Horst Clauberg, Petra Backus, Bob Chylak
ISQED
2003
IEEE
233views Hardware» more  ISQED 2003»
12 years 5 months ago
Active Device under Bond Pad to Save I/O Layout for High-pin-count SOC
To save layout area for electrostatic discharge (ESD) protection design in the SOC era, test chip with large size NMOS devices placed under bond pads has been fabricated in 0.35-Â...
Ming-Dou Ker, Jeng-Jie Peng, Hsin-Chin Jiang
ICCD
2005
IEEE
221views Hardware» more  ICCD 2005»
12 years 8 months ago
Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Brock J. LaMeres, Sunil P. Khatri
ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
11 years 9 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
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