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ICCD
2005
IEEE
221views Hardware» more  ICCD 2005»
12 years 10 months ago
Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Brock J. LaMeres, Sunil P. Khatri
books